Microstructure and Fabrication of Cu-Pb-Sn/Q235 Laminated Composite by Semi-Solid Rolling

Microstructure and Fabrication of Cu-Pb-Sn/Q235 Laminated Composite by Semi-Solid Rolling

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In the present work, Cu-Pb-Sn and Q235 laminated composite were fabricated by a horizontal semisolid rolling procedure.The interfacial structure, elemental distribution, and properties of the composite were investigated.Finite-element simulation was 4 Door Bottom Mount conducted to analyze the temperature field and solidification process during the semisolid rolling.An appropriate semi-solid region was observed at a pouring temperature of 1598 K in the simulation, which would effectively kept fluidity and avoided casting defects.

The experimental results showed that good interface between Cu-Pb-Sn alloy and Q235 steel was achieved by the proposed T-Shirts process at 1598 K, without casting defects or excessive deformation.The Cu and Fe alloys were bonded mainly by the diffusion of Fe into Cu matrix, and a handful of microscopic Pb-rich layer.Fine Pb-rich precipitates were uniformly distributed in the Cu-Pb-Sn alloy, and were considered to be advantageous to the self-lubrication property.The average tensile-shear strength of the interface was higher than 57.

68 MPa at a pouring temperature of 1598 K, which fulfilled the requirements for a further extrusion process.